Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538730 | Chip scale package structure of heat-dissipating type | HSIN-YEH HUANG, Chih-Hao Liao | 2022-12-27 |
| 11465234 | Laser soldering device and laser soldering method | Ren-Feng Ding, Hung-Wen Chen | 2022-10-11 |
| 11309626 | Wireless communication device | Chih-Hao Liao, HSIN-YEH HUANG | 2022-04-19 |
| 11219972 | Soldering process method | Hung-Wen Chen, Qi Huang, Yang-Hao Chou, Yun C. Sun | 2022-01-11 |