Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538730 | Chip scale package structure of heat-dissipating type | Chih-Hao Liao, Shu-Han Wu | 2022-12-27 |
| 11309626 | Wireless communication device | Chih-Hao Liao, Shu-Han Wu | 2022-04-19 |