Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2022-05-03 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Jiun Hann Sir, Eng Huat Goh | 2022-05-03 |