Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Chia-Peng Sun +3 more | 2022-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521903 | Method of measuring voids in underfill package | Chien-Ting Wu, Ching-Kai Chou, Kai Bai, Wei Yu Lin, Chia-Peng Sun +3 more | 2022-12-06 |