Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | You-Lung Yen, Bernd Karl Appelt | 2022-10-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462484 | Electronic package with wettable flank and shielding layer and manufacturing method thereof | You-Lung Yen, Bernd Karl Appelt | 2022-10-04 |