Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342315 | Stack packages including through mold via structures | Bok Kyu CHOI, Jae-Hoon Lee, Jin-Woo Park | 2022-05-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342315 | Stack packages including through mold via structures | Bok Kyu CHOI, Jae-Hoon Lee, Jin-Woo Park | 2022-05-24 |