Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393920 | Integrated assemblies and methods of forming integrated assemblies | David K. Hwang, Richard J. Hill, Scott E. Sills | 2022-07-19 |
| 11227777 | Sacrificial separators for wafer level encapsulating | — | 2022-01-18 |