Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434578 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Shaopeng Sun | 2022-09-06 |
| 11401618 | Cobalt filling of interconnects | John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson +1 more | 2022-08-02 |
| 11384446 | Compositions and methods for the electrodeposition of nanotwinned copper | Kyle Whitten, Stephan I. Braye, Pingping Ye, Thomas B. Richardson, Elie H. Najjar | 2022-07-12 |