Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11434578 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han | 2022-09-06 |
| 11401618 | Cobalt filling of interconnects | John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2022-08-02 |
| 11384446 | Compositions and methods for the electrodeposition of nanotwinned copper | Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar | 2022-07-12 |
| 11230778 | Cobalt chemistry for smooth topology | Shaopeng Sun, Stephan I. Braye, Elie H. Najjar | 2022-01-25 |