Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Hope Chiu, Cong Zhang, Fen Yu, Ada Shen +2 more | 2022-11-01 |
| 11444001 | Thermoelectric semiconductor device and method of making same | Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Wenbin Qu, Chin-Tien Chiu | 2022-09-13 |