Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380617 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Christopher J. Jezewski | 2022-07-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11380617 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Christopher J. Jezewski | 2022-07-05 |