Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277917 | Embedded component package structure, embedded type panel substrate and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen, Chien-Hao Wang | 2022-03-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11277917 | Embedded component package structure, embedded type panel substrate and manufacturing method thereof | Yu-Ju Liao, Chien-Fan Chen, Chien-Hao Wang | 2022-03-15 |