Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335646 | Substrate structure including embedded semiconductor device and method of manufacturing the same | Chien-Fan Chen | 2022-05-17 |
| 11296030 | Embedded component package structure and manufacturing method thereof | Chien-Fan Chen, Chien-Hao Wang | 2022-04-05 |
| 11277917 | Embedded component package structure, embedded type panel substrate and manufacturing method thereof | Chien-Fan Chen, Chien-Hao Wang, I-Chia Lin | 2022-03-15 |