Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309227 | Chip package structure having a package substrate disposed around a die | Jianping Fang, Yanqin Liao, Haohui Long | 2022-04-19 |
HS
Hui Si
Overall (2022): #427,254 of 548,613Top 80%
1
Patents 2022