JF

Jianping Fang

Huawei: 1 patents #1,433 of 3,814Top 40%
📍 Lakewood, CA: #9 of 20 inventorsTop 45%
🗺 California: #24,623 of 65,961 inventorsTop 40%
Overall (2022): #405,490 of 548,613Top 75%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11309227 Chip package structure having a package substrate disposed around a die Yanqin Liao, Haohui Long, Hui Si 2022-04-19