Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508644 | Semiconductor device package having thermally conductive pathways | Yazhou Zhang, Shineng Ma, Kent Yang | 2022-11-22 |
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Jiandi Du, Cong Zhang, Fen Yu, Ada Shen +2 more | 2022-11-01 |