Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11536900 | Integrated circuit structure with optical absorber layer over optical grating coupler | Benjamin V. Fasano, Andreas D. Stricker, Yusheng Bian, Bo Peng | 2022-12-27 |
| 11532864 | Microstrip line structures having multiple wiring layers and including plural wiring structures extending from one wiring layer to a shield on a different wiring layer | — | 2022-12-20 |
| 11355409 | Chip package with emitter finger cells spaced by different spacings from a heat sink to provide reduced temperature variation | Vibhor Jain, Alvin J. Joseph, Anthony K. Stamper | 2022-06-07 |