Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11316154 | High throughput insulation of 3D in-silicon high volumetric energy and power dense energy storage devices | John Collins, John M. Papalia, Devendra K. Sadana | 2022-04-26 |
| 11276767 | Additive core subtractive liner for metal cut etch processes | Ruqiang Bao, Kisup Chung, Andrew M. Greene, Sivananda K. Kanakasabapathy, Indira Seshadri +1 more | 2022-03-15 |