Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410945 | Semiconductor package having partial outer metal layer and packaging method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Kun-Chi Hsu, Ying Chen, Ting-Yeh Wu | 2022-08-09 |
| 11367641 | Wafer storage device, carrier plate and wafer cassette | I-Lin Chan, Chi Chang, Cheng-Hao Ciou | 2022-06-21 |