Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410945 | Semiconductor package having partial outer metal layer and packaging method thereof | Shih-Chun Chen, Sheng-Tou Tseng, Kun-Chi Hsu, Chin-Ta Wu, Ting-Yeh Wu | 2022-08-09 |