Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450697 | Chip package with substrate having first opening surrounded by second opening and method for forming the same | Kuei-Wei Chen, Chia-Ming Cheng | 2022-09-20 |
| 11306505 | Lock | — | 2022-04-19 |
| 11306514 | Connection lock | — | 2022-04-19 |