Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450697 | Chip package with substrate having first opening surrounded by second opening and method for forming the same | Chia-Ming Cheng, Chia-Sheng Lin | 2022-09-20 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450697 | Chip package with substrate having first opening surrounded by second opening and method for forming the same | Chia-Ming Cheng, Chia-Sheng Lin | 2022-09-20 |