Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521939 | Semiconductor device structure having stiffener with two or more contact points for heat dissipating element | Jui-Tzu Chen, Yu-Hsing Lin, Chia-Chieh Hu, Yu-Hsiang CHAO | 2022-12-06 |
| 11244909 | Package structure and method for manufacturing the same | Fan-Yu MIN, Chen-Hung LEE, Wei-Hang Tai, Yuan-Tzuo Luo, Wen Yuan Chuang +1 more | 2022-02-08 |