Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521939 | Semiconductor device structure having stiffener with two or more contact points for heat dissipating element | Jui-Tzu Chen, Yu-Hsing Lin, Chia-Chieh Hu, Chun-Cheng Kuo | 2022-12-06 |
| 11328965 | Systems and methods for suction pad assemblies | Chi-Ping Lei | 2022-05-10 |