Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521939 | Semiconductor device structure having stiffener with two or more contact points for heat dissipating element | Jui-Tzu Chen, Yu-Hsing Lin, Chun-Cheng Kuo, Yu-Hsiang CHAO | 2022-12-06 |