Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538787 | Method and system for manufacturing a semiconductor package structure | Che-Ting Liu, Jheng-Yu Hong, Yu-Ting Lu, Po-Chun Lee | 2022-12-27 |
| 11300466 | Pressure gauge with dual bourdon tubes | — | 2022-04-12 |
| 11275638 | Systems and methods for storing debug information | Chun-Ping Huang, Kuo-Chun Liao | 2022-03-15 |