Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538787 | Method and system for manufacturing a semiconductor package structure | Che-Ting Liu, Jheng-Yu Hong, Po-Chun Lee, Chih-Hsiang Hsu | 2022-12-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538787 | Method and system for manufacturing a semiconductor package structure | Che-Ting Liu, Jheng-Yu Hong, Po-Chun Lee, Chih-Hsiang Hsu | 2022-12-27 |