Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11437359 | Offset-aligned three-dimensional integrated circuit | Milind S. Bhagavat, Rahul Agarwal, Dmitri Yudanov | 2022-09-06 |
| 11367628 | Molded chip package with anchor structures | Priyal Shah, Milind S. Bhagavat, Lei Fu, Rahul Agarwal | 2022-06-21 |