Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367628 | Molded chip package with anchor structures | Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2022-06-21 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11367628 | Molded chip package with anchor structures | Milind S. Bhagavat, Brett P. Wilkerson, Lei Fu, Rahul Agarwal | 2022-06-21 |