Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11418885 | Micromechanical component for a sensor device or microphone device | Heribert Weber, Christoph Hermes, Peter Schmollngruber, Thomas Friedrich | 2022-08-16 |
| 11407635 | Bonding pad layer system, gas sensor and method for manufacturing a gas sensor | Bernd Klein, Heinz Nedelmann, Heribert Weber, Isolde Simon, Martin Lapisa +4 more | 2022-08-09 |