Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11407635 | Bonding pad layer system, gas sensor and method for manufacturing a gas sensor | Andreas Scheurle, Bernd Klein, Heinz Nedelmann, Heribert Weber, Martin Lapisa +4 more | 2022-08-09 |