Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296052 | TSV-less die stacking using plated pillars/through mold interconnect | Preston T. Meyers, Javier A. Falcon, Shawna M. Liff, Joe Saucedo, Adel A. Elsherbini +1 more | 2022-04-05 |