Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538746 | Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same | Yong She, Bin Liu, Aiping Tan, Li Deng | 2022-12-27 |
| 11302671 | Power enhanced stacked chip scale package solution with integrated die attach film | Zhijun Xu, Bin Liu, Yong She | 2022-04-12 |