Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538746 | Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same | Zhicheng Ding, Yong She, Bin Liu, Li Deng | 2022-12-27 |