Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443983 | Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant | Shaestagir Chowdhury, Biswadeep Saha, Erica J. Thompson | 2022-09-13 |