Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443983 | Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant | Shaestagir Chowdhury, Sirikarn Surawanvijit, Biswadeep Saha | 2022-09-13 |
| 11380683 | Fin end plug structures for advanced integrated circuit structure fabrication | Byron Ho, Chun-Kuo HUANG, Jeanne Luce, Michael L. Hattendorf, Christopher P. Auth +1 more | 2022-07-05 |