Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538731 | Thermal solutions for package on package (PoP) architectures | Bijendra Singh, Vikas Rao, Navneet Singh, Unnikrishnan G. Pillai | 2022-12-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538731 | Thermal solutions for package on package (PoP) architectures | Bijendra Singh, Vikas Rao, Navneet Singh, Unnikrishnan G. Pillai | 2022-12-27 |