Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538731 | Thermal solutions for package on package (PoP) architectures | Bijendra Singh, Vikas Rao, Sandesh Geejagaaru KRISHNAMURTHY, Unnikrishnan G. Pillai | 2022-12-27 |
| 11360528 | Apparatus and methods for thermal management of electronic user devices based on user activity | Columbia Mishra, Carin Ruiz, Helin Cao, Soethiha Soe, James G. Hermerding, II +1 more | 2022-06-14 |