Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538753 | Electronic chip with under-side power block | Ankireddy Nalamalpu, Scott Gilbert, Jin Zhao | 2022-12-27 |
| 11528809 | Method for orienting solder balls on a BGA device | Scott Gilbert | 2022-12-13 |
| 11500412 | Techniques for clock signal transmission in integrated circuits and interposers | Jeffrey Christopher Chromczak, Chooi Pei Lim, Lai Guan Tang, Chee Hak Teh, Dheeraj Subbareddy +1 more | 2022-11-15 |
| 11476185 | Innovative way to design silicon to overcome reticle limit | Dinesh Somasekhar, Dheeraj Subbareddy | 2022-10-18 |
| 11342238 | Rotatable architecture for multi-chip package (MCP) | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2022-05-24 |
| 11216397 | Translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh | 2022-01-04 |