Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495518 | Multi-surface heat sink suitable for multi-chip packages | Shrenik Kothari, Sandeep Ahuja, Susan F. Smith, Jeffory L. Smalley, Francisco Gabriel Lozano Sanchez +5 more | 2022-11-08 |
| 11296009 | Method and apparatus for detaching a microprocessor from a heat sink | Rolf Laido, Divya Swamy Bandaru, Thomas A. Boyd, Shelby Ferguson, Mustafa H. Haswarey | 2022-04-05 |