Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406015 | Bonding pad structure | Yu-Ting Liu, Chean Kee | 2022-08-02 |
| 11398430 | Package device and a manufacturing method thereof | Cheng-En Cheng, Yu-Ting Liu | 2022-07-26 |
| 11378618 | Method for manufacturing electronic device having a seed layer on a substrate | — | 2022-07-05 |