Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11474398 | Electronic devices having multiple alignment layers | Jen-Hai Chi | 2022-10-18 |
| 11406015 | Bonding pad structure | Yu-Ting Liu, Yeong-E Chen | 2022-08-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11474398 | Electronic devices having multiple alignment layers | Jen-Hai Chi | 2022-10-18 |
| 11406015 | Bonding pad structure | Yu-Ting Liu, Yeong-E Chen | 2022-08-02 |