Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Liu Chen, Chee Chiew Chong, Wee Aun Jason Lim | 2022-02-01 |
WT
Wee Boon Tay
Overall (2022): #213,578 of 548,613Top 40%
1
Patents 2022