Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239127 | Topside-cooled semiconductor package with molded standoff | Edward Myers, Chee Chiew Chong, Wee Aun Jason Lim, Wee Boon Tay | 2022-02-01 |
LC
Liu Chen
Overall (2022): #361,091 of 548,613Top 70%
1
Patents 2022