Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Gert Pfahl, Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig +1 more | 2022-08-09 |
| 11217500 | Semiconductor device and method for forming a semiconductor device | Jens Peter Konrath, Wolfgang Bergner, Romain Esteve, Richard Gaisberger, Florian Grasse +7 more | 2022-01-04 |