Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410950 | Semiconductor substrate having a bond pad material based on aluminum | Daniel Bolowski, Marian Sebastian Broll, Michael Kreuz, Evelyn Napetschnig, Holger Schulze +1 more | 2022-08-09 |