Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406022 | Substrate having through via and method of fabricating the same | Chih-I Wu, Shih-Ming Lin, Pin-Hao Hu, Hsin-Yu Chang, FU-LUNG CHOU +1 more | 2022-08-02 |
| 11338392 | Cutting method for forming chamfered corners | Hsin-Yu Chang, FU-LUNG CHOU, Chien-Jung Huang, Min-Kai Lee | 2022-05-24 |