Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406022 | Substrate having through via and method of fabricating the same | Chih-I Wu, Shih-Ming Lin, Yu-Chung Lin, Hsin-Yu Chang, FU-LUNG CHOU +1 more | 2022-08-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11406022 | Substrate having through via and method of fabricating the same | Chih-I Wu, Shih-Ming Lin, Yu-Chung Lin, Hsin-Yu Chang, FU-LUNG CHOU +1 more | 2022-08-02 |