Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469484 | Circuit structure | Hsiang En Ding | 2022-10-11 |
| 11363724 | Fabrication method of flexible electronic package device | Chien-Min Hsu, Chih-Ming Shen | 2022-06-14 |
| 11239141 | Lead frame package | Ren-Shin Cheng, Yu-Wei Huang, Chih-Ming Shen, Yi-Chieh TSAI | 2022-02-01 |