Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508877 | Red light emitting diode and manufacturing method thereof | Tung-Lin Chuang, Yi-Ru Huang, Yu-Chen Kuo, Tsung-Syun Huang, Jing-En Huang | 2022-11-22 |
| 11393955 | Light emitting diode and manufacturing method thereof | Yi-Ru Huang, Kai-Shun Kang, Tung-Lin Chuang, Yu-Chen Kuo, Yan-Ting Lan +1 more | 2022-07-19 |
| 11363724 | Fabrication method of flexible electronic package device | Chien-Min Hsu, Shih-Hsien Wu | 2022-06-14 |
| 11342488 | Light emitting diode chip and light emitting diode device | Tung-Lin Chuang, Yi-Ru Huang, Yu-Chen Kuo, Yan-Ting Lan, Jing-En Huang | 2022-05-24 |
| 11243520 | Human-machine interface system and communication control device thereof | Chih-Chung Chiu, Ming-Ji Dai | 2022-02-08 |
| 11239141 | Lead frame package | Ren-Shin Cheng, Shih-Hsien Wu, Yu-Wei Huang, Yi-Chieh TSAI | 2022-02-01 |
| 11239146 | Package structure | Chien-Min Hsu | 2022-02-01 |